This list is presented in inverse chronological order. Additional personal and hobby publications can be
found on my photographic web site  AEC PHOTOS

                        BIBLIOGRAPHY OF Dr. GERALD A. KRULIK

66.        Krulik, G.A., Poster Paper  “ARRoW 2910 EWNF for Copper CMP Wastewater Treatment”.
CMPUG Annual Meeting Oct 10, 2002. San Jose, CA.

65.        Krulik, G.A., “Copper CMP Wastewater Treatment”. Ultrapure Water. 18(7) 29-38 (September
2001). CLICK TO VIEW

64.        Krulik, G.A., “Removal of Arsenic and Fluoride from GaAs Wastewaters”. Ultrapure Water, 18 (2)
17-23 (February 2001). CLICK TO VIEW

63.        Krulik, G.A., “Metallizing”, in The Concise ECT (Encyclopedia of Chemical Technology), Wiley,
NY, (1998).

62.        Krulik, G.A., “CMP Cost of Ownership Reduction: Slurry Reprocessing”. Thin Solid Films  308-
309 (1997) 538-542. CLICK TO VIEW

61.        Krulik, G.A., “Prototype Design For In-Plant Recycle and Reduction of Copper Etchant Waste in
the Printed Circuit Industry”, Phase III, Grant Number 93-T0518, California Department of Toxic
Substances Control, Office of Pollution Prevention and Technology Development, 1994-1995, Report
date June 30, 1995.

60.        Krulik, G.A., “Recycle and Reuse of Nitrate Based Solder Strippers”, Phase I, Grant Number 93-
T0505, California Department of Toxic Substances Control, Office of Pollution Prevention and
Technology Development, 1994-1995, Report Date April 15, 1995.

59.        Krulik, G.A.,  Abbreviated version of “Metallizing” (from #57), in one volume condensation of the
Encyclopedia of Chemical Technology (titled, “A Concise Encyclopedia of Chemical Technology”), Wiley,
NY (1998) publication date.

58.        Krulik, G.A., Abbreviated version of “Electroless Plating” (from #50), in one volume condensation
of the Encyclopedia of Chemical Technology (titled, “A Concise Encyclopedia of Chemical Technology”),
Wiley, NY (1998) publication date.

57.        Krulik, G.A., N.V.Mandich, “Metallic Coatings (A Survey)”, in Encyclopedia of Chemical
Technology, 258-291, Vol. 16, 4th Edition, September, 1995. CLICK TO VIEW

56.         Krulik, G.A., N.V.Mandich, “R&D In the Year 2020”, in Russian, Electroplating & Surface
Treatment (Moscow), 2(6) 62-64 (1993). CLICK TO VIEW

55.        Krulik, G.A., “Novel Cyanide-free Electroless Silver Technology for Reduction of Hazardous
Waste in the Plating and Printed Circuit Industries”, Phase II Grant Number 92-T0121, California
Department of Toxic Substances Control, Office of Pollution Prevention and Technology Development,
1993-1994, Report Date April 18, 1994.

54.        Krulik, G.A., “In-Plant Recycle and Reduction of Copper Etchant Waste in the Printed Cricuit
Industry”, Phase II Grant Number 92-T0120, California Department of Toxic Substances Control, Office
of Pollution Prevention and Technology Development, 1993-1994, Report Date April 11, 1994.

53.        Krulik, G.A., N.V.Mandich and R.S.Sidhu, (In Russian), “Electroless Gold”, English Title
Electrodepositon of Metals and Alloys (?Electroplating & Surface Treatment), 2(4), 27-32 (1993). CLICK
TO VIEW

52.        Krulik, G.A., N.V.Mandich, “Selecting and Troubleshooting Chemical Conversion Coatings”, (Part
2), Product Finishing (Gr.Britain), 47 (1) 20-23 (January 1994). CLICK TO VIEW

51.        Krulik, G.A., N.V.Mandich, “Selecting and Troubleshooting Chemical Conversion Coatings”, (Part
1), Finishing (Gr.Britain), 46 (12) 26-28 (December 1993) CLICK TO VIEW

50.        Krulik, G.A., “Electroless Plating”, in Encyclopedia of Chemical Technology, 198-218, Vol. 9, 4th
Edition, 1994.  CLICK TO VIEW

49.        Krulik, G.A., N.V.Mandich, “On the Mechanisms of Plating on Plastics”, Plating & Surface
Finishing, 80(12), 68-73, (Dec. 1993).   CLICK TO VIEW

48.        Krulik, G.A., R.Sidhu and N.Simpkins, “A Unique Electroless Gold Bath”, CircuiTree, 6(6), 10-12
(1993).  CLICK TO VIEW

47.        Krulik, G.A., N.Mandich, “Fundamentals of Hydrogen Embrittlement”, Metal Finishing, 91(3), 54-
56, 1993.  CLICK TO VIEW

46.        Krulik, G.A., N.Mandich, “Fundamentals of Electroless Copper Bath Operation for Printed Circuit
Boards”, Metal Finishing, 91(1), 33-36, 1993. CLICK TO VIEW

45.        Krulik, G.A., N. Mandich, “Chemistry of Modern Permanganate Etchback Systems for Printed
Circuit Board Production”, Plating and Surface Finishing, 79(12), 56-61, 1992. CLICK TO VIEW

44.        Krulik, G.A., N. Mandich, “Substitution of Hazardous For Non-hazardous Process Chemicals in
the Printed Circuit Industry”, Metal Finishing, 90, 49-51, Nov. 1992. CLICK TO VIEW

43.        Krulik, G.A.,“Solder and Copper Recovery from Scrap Printed Circuit Boards Without Generation
of Hazardous Lead Intermediates”, Phase I Grant No. 90-T0083, California Dept. of Health Services,
Alternative Technology Division, 1991-1992, Report June 16, 1992.

42.        Krulik, G.A.,“Fluoride and Boron-free Stripper for Removal of Solder from Printed Circuit Boards”,
Phase II Grant No. 90-T0082, California Dept. of Health Services, Alternative Technology Division, 1991-
1992, Report June 16, 1992.

41.        Krulik, G.A.,“Fluoride and Boron-free Stripper for Removal of Solder from Printed Circuit Boards”,
Phase I Grant No. 89-T0115, California Dept. of Health Services, Alternative Technology Division, 1990-
1991, Report April 30, 1991.

40.        Krulik, G.A., N. Mandich, “Effect of Selected Metals on Electroless Plating Catalyst”, Trans.Inst.
Metal Finishing, 70(3), 117-119, 1992. CLICK HERE

39.        Krulik, G.A., N. Mandich, “The Mechanisms of Catalytic Processes in Electroless Plating”, Trans.
Inst.Metal Finishing, 70(3), 111-116, 1992. CLICK HERE

38.        Krulik, G.A., N. Mandich and R. Sidhu, “A Contribution Towards Understanding the Phenomenon
of Pink Ring”, Plat. & Surf.Finishing 79 (6), 74-80, 1992. CLICK HERE

37.        Krulik, G.A., N. Mandich, “The Evolution of a Process: 50 Years of Electroless Nickel”, Metal
Finishing, 90(5), 25-27, May 1992.  CLICK HERE

36.        Krulik, G.A., N. Mandich, “A Novel Biogenic Source for Electroless Nickel Plating”, Metal Finishing
90(3), 9-10, March 1992.  CLICK HERE

35.        Krulik, G.A., T. Choo and N. Simpkins, “A New Waste Treatment Method for Spent Photoresist
Stripper”,  published from Spring Meeting, 1991, IPC publication.  CLICK HERE

34.        Krulik, G.A., “Metallizing”, in Concise Encyclopedia of Polymer Science and Engineering, J.I.
Kroschwitz, editor, p.605-7, Wiley, NY (1990).  CLICK HERE

33.        Krulik, G.A., “Regeneration of Permanganate Etchant Systems”, Institute of Printed Circuits Fall
Meeting, 1987, published January, 1988,IPC-TP-657.  CLICK HERE

32.        Krulik, G.A., “Permanganate Etchback For Multilayer Boards”, Printed Circuit Fabrication, 10(8), p.
45-51, August, 1987.  CLICK HERE

31.        Krulik, G.A., “Simulation of Electroless Copper Plating Baths by Computers”, Printed Circuit
Fabrication, 10(2), p.34-38, February, 1987. CLICK HERE

30.        Krulik, G.A., M.A.Lipson, S.C.Davis “The Combined Approach”, Printed Circuit Fabrication, 9(8), p.
28-36, August, 1986. CLICK HERE

29.        Krulik, G.A., M.A.Lipson, J.B.Davison, S.C.Davis “Der Copperstat - Prozess: Eine neue
Konzeption fur die Reinigung und Kontrolle von stromlos abscheidended Kupferbadern”, (The
Copperstat Process: A New Concept for Electroless Copper Bath Purification and Control),
Galvanotechnik, 76(11), p.1806-1811 (1985). CLICK HERE FOR ENGLISH VERSION
CLICK HERE FOR GERMAN VERSION

28.        Krulik, G.A., “Metallizing”, in Encyclopedia of Polymer Science and Engineering, eds. Mark,
Bikales, Overberger, Menges, V.9, p.580-98, Wiley, NY (1987). CLICK HERE

27.        Krulik, G.A., “40 Questions & Answers About Electroless Plating for RFI Shielding”, Metal
Finishing, 82, p.75-77, June, 1984. ENGLISH VERSION        JAPANESE VERSION

26.        Krulik, G.A., Finishing Tip of the Month, “Rapid Thickness Testing Method”, Plating & Surface
Finishing, 71(3), p.24, March, 1984. CLICK HERE

25.        Krulik, G.A., “Electroless Plating” (reprint of #3), in Encyclopedia of Semiconductor Technology,
M.Grayson, ed., p.145-58, Wiley, NY (1984). CLICK HERE

24.        Krulik, G.A., “Corrosion Resistance of Electroless Deposits for Electromagnetic Interference
Shielding”, Plating & Surface Finishing, 71(12), p.56-8, December, 1984. CLICK HERE

23.        Krulik, G.A., “Electrolytic Plating”, Chapter 19 in Technology of Plastic Surfaces Decoration, by D.
Satas, ed., p.268-86, Van Nostrand Reinhold, NY (1986). CLICK HERE

22.        Krulik, G.A., “Electroless Plating for EMI Shielding”, chapter for ITEM (Interference Technology
Engineers’ Master), R & B Enterprises, Plymouth Meeting, Pennsylvania, p.180-88 (1984). CLICK HERE

21.        Krulik, G.A., Dr. Waldemar Immel, “Die Verwendung chemisch abgescheidener Metalluberzuge
fur die Abschirmung hochfrequenter elektromagnetischer Wellen”, (The use of chemically refined metal
coatings for the shielding of high frequency electromagnetic waves), Galvanotecknic, (1983). CLICK
HERE FOR GERMAN VERSION.          CLICK HERE FOR ENGLISH VERSION.

20.        Krulik, G.A., “EMI Shielding:Big Opportunity For Finishers”, Products Finishing, 48, p.49-57,
October, 1983.  CLICK HERE

19.        Krulik, G.A., “The Joys of Technical Service”, Industrial Finishing, 59, p.42-6, August, 1983.
CLICK HERE

18.        Krulik, G.A., “EMI/RFI Shielding - A Boon for Electroless Plating”, Industrial Finishing, 59, p.16-
18, May, 1983. CLICK HERE

17.        Krulik, G.A., Juan Hajdu, “Typical Processing and Operating Sequences:Plastics”, in
Electroplating Engineering Handbook, ed. L.J.Durney, 4th ed., p.202-5, Van Nostrand Reinhold, NY
(1984). CLICK HERE

16.        Krulik, G.A., John Waggoner, “Electroplating and Sputtering”, Modern Plastics Encyclopedia, p.
372-4 (1984-5). CLICK HERE

15.        Krulik, G.A., John Waggoner, “Electroplating and Sputtering”, Modern Plastics Encyclopedia, p.
358-62 (1983-4). CLICK HERE

14.        Krulik, G.A., Abbreviated version of “Electroless Plating” (from #3), in one volume condensation
of the Encyclopedia of Chemical Technology (titled, “A Concise Encyclopedia of Chemical Technology”),
p.407-8, Wiley, NY (1985). CLICK HERE.

13.        Krulik, G.A., “Are Electroless Deposits Always Uniform?”, Products Finishing, p.80-1, April, 1983.
CLICK HERE.

12.        Krulik, G.A., Juan Hajdu, “Comparison of Electroless Deposits for Electromagnetic Interference
Shielding” Plating & Surface Finishing, 70(7), p.42-44, July, 1983. CLICK HERE.

11.        Krulik, G.A., “Pretreatment Makes the Difference in Electroless Nickel  Plating”, Industrial
Finishing, 58(3), p.20-1, March, 1982. CLICK HERE.

10.        Krulik, G.A., “Tin-Palladium Catalysts for Electroless Plating”, Platinum Metals Review, 26(2), p.
58-64, April, 1982. CLICK HERE.

9.        Krulik, G.A., J.Waggoner, “Electroplating”, Modern Plastics Encyclopedia, p.406-410 (1982-3).
CLICK HERE.

8.        Krulik, G.A., J.Waggoner, “Electroplating”, Modern Plastics Encyclopedia, p.448-50 (1981-82).
CLICK HERE.

7.        Krulik, G.A., “Report on Ammonia-Free Electroless Nickel”, Products Finishing, 48, p.65, January,
1981. HAVE NO COPY.

6.        Krulik, G.A., H.Goldman, “Electroplating”, Modern Plastics Encyclopedia, (1980-81).HAVE NO
COPY.

5.        Krulik, G.A., “Laboratory Experiments in Electroless Plating” (published in Spanish as “Plateado
No-Electrolitico Experimentos Do Laboratorio”), Revista Chilena de Educacion Quimica, 5(4), p. 142-
146 (1980). SPANISH VERSION, CLICK HERE. ENGLISH VERSION, CLICK HERE.

4.        Krulik, G.A., “Hydrous Melt Catalyst Synthesis”, J. Catalysis, 65(1), p. 95-104 (1980). CLICK HERE.

3.        Krulik, G.A., “Electroless Plating”, Encyclopedia of Chemical Technology, eds. M.Grayson, D.
Eckroth, 399rd ed., (1979), V.8, p.738-750, Wiley, New York. CLICK HERE.

2.        Krulik, G.A., “Electroless Plating of Plastics”, J.Chemical Education, 55(6), p.361-5 (1978).CLICK
HERE.

1.        Krulik, G.A., K.R.Lauterer, “Electroplating”, Modern Plastics Encyclopedia, p.433-6 (1977-8),
McGraw-Hill, NY. CLICK HERE.
APPLIED ELECTROLESS CONCEPTS
TECHNICAL PUBLICATIONS OF DR. KRULIK
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