APPLIED ELECTROLESS CONCEPTS
PATENTS AWARDED DR. GERALD KRULIK

Bibliography of US Patents of Gerald A. Krulik.

Shown in reverse chronological order.

43. US 6,998,054 (2-14-06). “Selective Fluoride and Ammonia Removal by Chromatographic Separation
of Wastewater.”

42. US 6,723,246 (4-20-04). “Filter Cleaning Method”.

41. US 6,652,738 (11-25-03). “Simultaneous Ammonia and fluoride Treatment for Wastewater”.

40. US 6,645,385 (11-11-03). “System and Method for Removal of Fluoride from Wastewater Using Single
Fluoride Sensing Electrode”.

39. US 6,613,230 (9-2-03). “Method for Simultaneous Removal of Arsenic and Fluoride from Aqueous
Solutions”.

38. US 6,582,605 (06-24-03). “Method of Treating Industrial Waste Waters”.

37. US 6,143,155 (11-7-00), “Method for Simultaneous Non-Contact Electrochemical Plating and
Planarizing of Semiconductor Wafers Using a Bipolar electrode Assembly”.

36. US 6,132,586 (10-17-00), “Method and Apparatus for Non-Contact Metal Plating of Semiconductor
Wafers Using a Bipolar Electrode Assembly”.

35. US 6,121,152 (9-19-00), “Method and Apparatus for Planarization of Metallized Semiconductor Wafers
Using a Bipolar Electrode Assembly”.

34. US 5,876,685 (3-2-99), “Separation & Purification of Fluoride from Industrial Wastes”.

33. US 5,868,906 (2-9-99), “Dehydration and Purification of Isopropyl Alcohol to an Ultradry and Ultrapure
Level”.

32. US 5,855,792 (1-5-99), “Rinse Water Recycling Method for Semiconductor Wafer Processing
Equipment”.

31. US 5,853,963 (12-29-98), “Life Extension of Photoresist Developer Solutions”.

30. US 5,755,614 (5-26-98),”Rinse Water Recycling In CMP Apparatus”.

29. US 5,722,875 (3-3-98) , “Method and Apparatus for Polishing”.

28. US 5,664,990 (9-9-97) , Krulik, G.A., “Recycle Process for Regeneration of CMP Slurry”.
27. US 5,556,553 (9-17-96), Krulik, G.A., “Recycle Process for Regeneration of Ammoniacal Copper
Etchant”.

26. US 5,524,780 (6-11-96), Krulik, G.A., “Control of Regeneration of Ammoniacal Copper Etchant”.

25. US 5,512,201 (4-30-96), Krulik, G.A., “Solder and Tin Stripper Composition”.

24. US 5,505,872 (4-9-96), Krulik, G.A., “Solder Stripper Recycle and Reuse”.

23. US 5,322,553 (6-21-94), Krulik, G.A., “Electroless Silver Plating Bath”.

22. US 5,318,621 (6-7-94), Krulik, G.A., “Plating Rate Improvement for Electroless Gold and Silver Plating
Baths”.

21. US 5,252,225 (10-12-93), Krulik, G.A., “Method For Precipitating an Organic Resin From an Alkaline
Solution Thereof”.

20. US 5,232,492 (8-3-93), Krulik, G.A., ”Electroless Gold Plating Composition”.

19. US 5,219,815 (6-15-93), Krulik, G.A., “Low Corrosivity Catalyst Containing Ammonium Ions for
Activation of Copper For Electroless Nickel Plating”.

18. US 5,219,484 (6-15-93), Krulik, G.A., “Solder and Tin Stripper Compositions”.

17. US 5,212,138 (5-18-93), Krulik, G.A., “Low Corrosivity Catalyst For Activation of Copper For Electroless
Nickel Plating”.

16. US 5,194,583  (3-16-93), Krulik, G.A., “Method for Neutralizing an Aqueous Solution of an Organic
Resin”.

15. US 4,805,553 (2-21-89), Krulik, G.A., “Apparatus for Bailout Elimination and for Enhancing Plating
Bath Stability in Electrosynthesis/ Electrodialysis Electroless Copper Purification Process”.

14. US 4,786,393 (11-22-88), Krulik, G.A., “Leak-free Plastic Flow Spacers For Electrodialysis Apparatus
and a Method For the Making Thereof”.

13. US 4,762,601 (8-9-88), Krulik, G.A., “Copper Bath for Electroless Plating Having Excess Counter-
Cation and Process using Same”.

12. US 4,719,128 (1-12-88), Krulik, G.A., “Method of and Apparatus for Bailout Elimination and for
Enhancing Plating Bath Stability In Electrosynthesis/Electrodialysis Electroless Copper Purification
Process”.

11. US 4,698,124 (10-6-87), Krulik, G.A., “Method of Regenerating Permanganate Etchbath”.

10. US 4,671,861 (6-9-87), Krulik, G.A., “Measurement and Control of Net Caustic Production During
Electrodialysis”.

9. US 4,601,784 (7-22-86), Krulik, G.A., “Sodium Permanganate Etch Baths Containing a Co-Ion For
Permanganate and Their Use In Desmearing and/or Etching Printed Circuit Boards”.

8. US 4,601,783 (7-22-86), Krulik, G.A., “High Concentration Sodium Permanganate Etch Bath and its
Use In Desmearing and/or Etching Printed Circuit Boards”.

7. US 4,212,768 (7-15-80) Krulik, G.A., M.N.Jameson, “Electroless Plating of Non-Conductive Substrates”.

6. US 4,188,227 (2-12-80) Krulik, G.A., R.L.Bauer, “Use of Molten Hydrated Salt of Low melting Point as
Matrix in Homogeneous Chemical Composition”.

5. US 4,182,784 (1-8-80), Krulik, G.A., “Method for Electroless Plating on Non-Conductive Substrates
Using Palladium/Tin catalyst in Aqueous Solution Containing a Hydroxy-Substituted Organic Acid”.

4. US 4,180,480 (12-25-79) Krulik, G.A., M.N.Jameson, “Catalytically Active Compositions from Precious
Metal Complexes”.

3. US 4,120,822 (10-17-78) Krulik, G.A., M.N.Jameson, J.D.Klicker, J.F.York, “Catalytically Active
Composition for Electroless Plating”.

2. US 3,940,270 (2-24-76) Krulik, G.A., H.J.Sable, “Reproduction System Utilizing Ion Modular and
Dielectric Imaging Surface.”

1. US 3,937,571 (2-10-76) Krulik, G.A., H.J.Sable, “Reproduction System Utilizing Ion Modular and
Dielectric Imaging Surface.”

Other patents on waste treatment, hazardous chemical recycling, and electroless plating, in process.

Also the corresponding patents in up to 12 foreign countries, such as Fr 76-13435; Ger 2,619,889,
2,639,797; Eur. Pat. 545,537; 510,794, 396,252, 267767, 232,079; 204399;etc. Other patents are in the
process of being issued.
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